Printed circuit board with embedded component and method for manufacturing same

ABSTRACT

A printed circuit board with embedded component includes a double-sided printed circuit board, an electronic component, a plurality of conductive paste blocks, an insulating layer and a wiring layer near the first wiring layer, an insulating layer and a wiring layer near the second wiring layer. The double-sided printed circuit board comprising a first wiring layer, a base, and a second wiring layer. The first wiring layer and the second wiring layer are arranged on opposite sides of the base. The second wiring layer includes a plurality of electrical contact pads. The base defines a number of conductive vias. Each electrical contact pad is aligned with and electrically connected to one corresponding conductive via. The conductive paste blocks are electrically connecting to the conductive vias. The electronic component is electrically connected to the conductive paste blocks. The two insulating layers cover the electronic component and the second wiring layer.

BACKGROUND

1. Technical Field

The present disclosure generally relates to printed circuit boards(PCBs), and particularly relates to a printed circuit board withembedded component and a method for manufacturing the printed circuitboard with embedded component.

2. Description of Related Art

To accommodate development of miniaturized electronic products withmultiple functions, printed circuit boards with embedded component arewidely used.

A method of manufacturing the printed circuit board with embeddedcomponent includes following steps. A through hole is defined in acircuit board. A supporting material layer is formed at a side of thecircuit board. The supporting material layer covers the through hole. Anelectronic component is arranged in the through hole, and is fixed onthe supporting material layer. A first adhesive layer is laminated onthe other side of the circuit board, such that the electronic componentis adhered to the first adhesive layer. The supporting material layer isremoved from the circuit substrate, and a second adhesive sheet islaminated on the circuit substrate, such that the circuit substrate issandwiched between the first adhesive sheet and the second adhesivesheet, and the electronic component is adhered on the second adhesivesheet. In addition, a first copper layer and a second copper layerrespectively laminated onto the first adhesive sheet and the secondadhesive. Therefore, the first copper layer and the second copper layerrespectively are converted into a first wiring layer and a second wiringlayer, and a plurality of conductive vias are defined by laser drillingprocess and electroplating process, such that the first wiring layer iselectrically connected to electrodes of the electronic component throughthe conductive vias. Therefore, a first solder mask and a second soldermask are respectively formed on the first wiring layer and the secondwiring layer, thereby a printed circuit board with embedded component isobtained. In the above method, the alignment accuracy between theconductive vias and the electronic component is not better.

What is needed therefore is a printed circuit board with embeddedcomponent, and a method for manufacturing the printed circuit board withembedded component to overcome the described limitations.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood withreference to the following drawings. The components in the drawings arenot necessarily drawn to scale, the emphasis instead being placed uponclearly illustrating the principles of the present embodiments.Moreover, in the drawings, all the views are schematic, and likereference numerals designate corresponding parts throughout the severalviews.

FIG. 1 shows a double-sided copper clad lamination according to a firstembodiment.

FIG. 2 shows a plurality of conductive vias formed in the double-sidedcopper clad lamination of FIG. 1.

FIG. 3 shows a plurality of filling through holes defined in thedouble-sided copper clad lamination of FIG. 2.

FIG. 4 shows copper layers converted by the copper layers in FIG. 3.

FIGS. 5&6 are plan views of the double-sided copper clad laminationaccording to two exemplary embodiments.

FIG. 7 shows conductive paste blocks formed on the double-sided copperclad lamination of FIG. 4.

FIG. 8 shows an electronic component electrically connected to theconductive paste blocks in FIG. 6 to obtain a multilayer substrate.

FIG. 9 shows insulating layers and circuit layers formed on the oppositeside of the multilayer substrate of FIG. 8 to obtain a printed circuitboard with embedded component.

FIG. 10 shows a double-sided copper clad lamination according to asecond embodiment.

FIG. 11 shows a plurality of conductive vias formed in the double-sidedcopper clad lamination of FIG. 10.

FIG. 12 shows a plurality of filling through holes defined in thedouble-sided copper clad lamination of FIG. 11.

FIG. 13 shows copper layers converted by the copper layers in FIG. 12.

FIG. 14 shows insulating layer and circuit layer formed on the one sideof the double-sided copper clad lamination of FIG. 13.

FIG. 15 shows an electronic component arranged on the double-sidedcopper clad lamination of FIG. 14 to obtain a multilayer substrate.

FIG. 16 shows insulating layers and circuit layers formed on theopposite side of the multilayer substrate of FIG. 15 to obtain a printedcircuit board with embedded component.

DETAILED DESCRIPTION

A method for manufacturing a printed circuit board with embeddedcomponent according to a first embodiment includes the following steps.

FIGS. 1&2 show that in step (1), a double-sided copper clad lamination10 is provided. A plurality of first conductive vias 11 is formed in thedouble-sided copper clad lamination.

In the present embodiment, the double-sided copper clad lamination 10includes a base 12, a first copper layer 13, and a second copper layer14. The base 12 is an insulating base. The base 12 includes a firstsurface 121 and a second surface 122 opposite to the first surface 121.The first copper layer 13 is arranged on the first surface 121. Thesecond copper layer 14 is arranged on the second surface 122. The firstconductive vias 11 are blind holes which pass through the first copperlayer 13 and the base 12. The first conductive vias 11 are formed by amechanical drilling or a laser drilling process and then by anelectroplating or a via filling process. In other embodiments, the firstconductive vias 11 are defined to pass through the first copper layer13, the base 12 and the second copper layer 14. The first copper layer13 is electrically connected to the second copper layer 14 through thefirst conductive vias 11. In the present embodiment, the number of thefirst conductive vias 11 is six. In other embodiment, the number of thefirst conductive vias 11 can be two, three, four, five or more than six.

FIGS. 3-6 show that in step 2, a filling through hole 102 or a pluralityof through holes 102 is defined to pass through the first copper layer13, the base 12 and the second copper layer 14. A first wiring layer 132is formed by selectively etching the first copper layer 13 and a secondwiring layer 142 is formed by selectively etching the second copperlayer 14. Accordingly, a double-sided printed circuit board 17 isobtained.

The second wiring layer 142 includes a plurality of electrical contactpads 143. In the present embodiment, the number of the electricalcontact pads 143 is six which is same as that of the first conductivevias 11. Each of the electrical contact pads 143 is aligned with andelectrically connected to one first conductive via 11. In the presentembodiment, the end of the first conductive via 11, which is adjacent tothe first surface 121, is coplanar with the first surface 121. In otherembodiment, the end of the first conductive via 11, which is adjacent tothe first surface 121, can be at a lower level than the first surface121. The first conductive vias 11 are divided into two rows. The fillingthrough hole 102 is arranged between the two rows of the firstconductive vias 11. The number of the through holes 102 may be one (seeFIG. 5), two (see FIG. 6) or more than two. The shape of the throughholes 102 may be circle, oval, rectangle, polygon, or irregular shape.

FIGS. 7-8 show that, in step 3, a plurality of conductive paste blocks15 is formed on the first surface 121. Each conductive pastes block 15is aligned with one corresponding electrical contact pad 143. Each ofthe conductive paste blocks 15 covers and is electrically connected toone end of the first conductive via 11 electrically connected to thecorresponding electrical contact pad 14. A plurality of electroniccomponents 16 is provided, and each electronic component 16 is alignedwith a pair of the first conductive via 11. The electronic components 16are adhered with and electrically connected to the correspondingconductive paste blocks 15. Accordingly, a multilayer substrate 20 isobtained.

In the present embodiment, the electronic components 16 may be passiveelements or active elements, (e.g. chips, resistors, or capacitors)which include two electrodes 162. When the electronic component 16 isarranged on the conductive paste blocks 15, the two electrodes 162 arerespectively fixed and connected to the corresponding two conductivepaste blocks 15. The material of the conductive paste blocks 15 can beconductive solder paste, conductive silver paste, or conductive copperpaste, for example.

FIG. 9 shows that in step 4, a first insulating layer 21 and a thirdwiring layer 22 are formed on the first wiring layer 132 of themultilayer substrate 20 in described order. A second insulating layer 23and a fourth wiring layer 24 are formed on the second wiring layer 142of the multilayer substrate 20 in described order. Accordingly, aprinted circuit board with embedded component 100 is obtained.

The following steps may be used to form the first insulating layer 21,the third wiring layer 22, the second insulating layer 23, and thefourth wiring layer 24.

First, a third copper layer (not shown), the first insulating layer 21,the multilayer substrate 20, the second insulating layer 23, and afourth copper layer (not shown) are stacked, and laminated onto eachother to form a main body.

The first insulating layer 21 and the second insulating layer 23 usuallyare adhesive sheets, e.g. FR4 epoxy glass cloth half-cured adhesivesheets. After lamination, the first insulating layer 21 covers the firstwiring layer 132, exposed portions of the first surface 121, lateralsurfaces of the electronic components 16 and top surfaces of theelectronic components 16 opposite to the first surface 121, therefore,the electronic components 16 are embedded in the first insulating layer21. The second insulating layer 23 covers the second wiring layer 142and exposed portions of the second surface 122, and enters into sides ofthe electronic components 16 adjacent to the first surface 121 throughthe filling through hole 102, and fills into gaps between the electroniccomponents 16 and the first surface 121. After the lamination iscompleted, the second insulating layer 23 fully fills the fillingthrough hole 102 and the gaps between the electronic components 16 andthe first surface 121.

Second, a plurality of second conductive vias 25 are formed in the firstinsulating layer 21, a plurality of third conductive vias 26 are formedin the second insulating layer 23, and the third copper layer and thefourth copper layer are respectively converted into the third wiringlayer 22 and the fourth wiring layer 24. The third wiring layer 22 iselectrically connected to the first wiring layer 132 by the secondconductive vias 25. The fourth wiring layer 24 is electrically connectedto the second wiring layer 142 by the third conductive vias 26. Thesteps of forming the second conductive vias 25 and the third conductivevias 26 may be processed before the steps of forming the third wiringlayer 22 and the fourth wiring layer 24. The second conductive vias 25and the third conductive vias 26 may be formed by a mechanical drillingor a laser drilling process and then by an electroplating or a viafilling process. The via filling process may be a plating process, or acopper paste filling process, or a silver paste filling process. Thethird wiring layer 22 and the fourth wiring layer 24 may be formed by animage transfer process and an etching process.

There may be two or more wiring layers formed at the side of the thirdwiring layer 32, and there may be two or more wiring layers formed atthe side of the fourth wiring layer 24.

The printed circuit board with embedded component 100 includes themultilayer substrate 20, the first insulating layer 21, the third wiringlayer 22, the second insulating layer 23, and the fourth wiring layer24. The multilayer substrate 20 includes the base 12, the first wiringlayer 132, the second wiring layer 142, and the electronic components16. The base 12 is sandwiched between the first wiring layer 132 and thesecond wiring layer 142. The base 12 has the first surface 121, and thesecond surface 122 opposite to the first surface 121. The first wiringlayer 132 is formed on the first surface 121. The second wiring layer142 is formed on the second surface 122. The second wiring layer 142includes the electrical contact pads 143. The first conductive vias 11and the filling through hole 102 are defined in the base 12. Eachelectrical contact pad 143 is electrically connected to one firstconductive via 11. The ends of the first conductive vias 11 adjacent tothe first surface 121 are coplanar with or lower than the first surface121. The filling through hole 102 passes through the first wiring layer132, the base 12 and the second wiring layer 142, and is located betweenthe first conductive vias 11. The printed circuit board with embeddedcomponent 100 further includes the conductive paste blocks 15 spatiallycorresponding to the electrical contact pads 143. Each conductive pasteblock 15 contacts with, and is electrically connected to the end of thecorresponding first conductive via 11. The electronic component 16 iselectrically connected to the first conductive vias 11 by the conductivepaste blocks 15, such that the electronic component 16 is electricallyconnected to the electrical contact pads 143. In the present embodiment,the electronic component 16 includes two electrodes 162, and there aretwo electrical contact pads 143, and two conductive paste blocks 15.Each electrode 162 is adhered to one conductive paste block 15. Thesecond insulating layer 21 is formed on the first wiring layer 132. Thefirst insulating layer 21 covers the first wiring layer 132, exposedportions of the first surface 121, lateral surfaces of the electroniccomponents 16 and top surfaces of the electronic components 16 oppositeto the first surface 121, therefore, the electronic components 16 areembedded in the first insulating layer 21. The third wiring layer 22 isformed on the surface of the first insulating layer 21 further away fromthe first surface 121, and is electrically connected to the first wiringlayer 132 through the second conductive vias 25. The second insulatinglayer 23 is formed on the second wiring layer 142, covering a pluralityof portions of the second wiring layer 142 to expose the other portionsof the second wiring layer 142, and fully filling the filling throughhole 102 and the gaps between the electronic components 16 and the firstsurface 121. The fourth wiring layer 24 is formed on the surface of thesecond insulating layer 23 further away from the second surface 122.

It is understood that the number of the electronic components 16 may bemore than or less than 3. In such case, the number of the conductivepaste blocks 15, the number of the electrical contact pads 143, and thenumber of the first conductive vias 11 should be changed to match withthe number of the electronic components 16.

FIGS. 10-16 show that, a method for manufacturing a printed circuitboard with embedded component according to a second embodiment includesthe following steps.

FIGS. 10-11 show that in step (1), a double-sided copper clad lamination10A is provided. A plurality of first conductive vias 11A is formed inthe double-sided copper clad lamination.

In the present embodiment, the double-sided copper clad lamination 10Aincludes a base 12A, a first copper layer 13A, and a second copper layer14A. The base 12A includes a first surface 121A and a second surface122A opposite to the first surface 121A. The first copper layer 13A isarranged on the first surface 121A. The second copper layer 14A isarranged on the second surface 122A. The first conductive vias 11A areblind holes pass through the first copper layer 13A and the base 12A.The first conductive vias 11A are formed by a mechanical drilling or alaser drilling process and then by a electroplating or a via fillingprocess. In the present embodiment, the number of the first conductivevias 11A is six. In other embodiment, the number of the first conductivevias 11A may be two, three, four, five or more than six.

FIGS. 12-13 show that in step 2, a filling through hole 102A or aplurality of through holes 102A is defined to pass through the firstcopper layer 13A, the base 12A and the second copper layer 14A. A firstwiring layer 132A is formed by selectively etching the first copperlayer 13A and a second wiring layer 142A is formed by selectivelyetching the third copper layer 14A.

The second wiring layer 142A includes a plurality of electrical contactpads 143A. In the present embodiment, the number of the electricalcontact pads 143A is six which is same as that of the first conductivevias 11A. Each of the electrical contact pads 143A is aligned with andelectrically connected to one first conductive via 11A. The first copperlayer 13A faced to the first conductive vias 11A is etched, such thatthe end of the first conductive via 11A, which is adjacent to the firstsurface 121A, is coplanar with the first surface 121A. In otherembodiment, the end of the first conductive via 11A, which is adjacentto the first surface 121A, may be lower than the first surface 121A.

The first conductive vias 11A are arranged like that in FIG. 5. Thefilling through hole 102A is arranged between the first conductive vias11A. The number of the through holes 102A may be one (arranged same tothat of FIG. 5), two (arranged same to that of FIG. 6) or more than two.The shape of the through holes 102A may be circle, oval, rectangle,polygon, or irregular shape.

FIG. 14 show that in step 3, a first insulating layer 21A and a thirdwiring layer 22A are formed on the first surface 121A in describedorder. An opening 211A is defined to pass through the first insulatinglayer 21. The end of the first conductive vias 11A and the fillingthrough hole 102A are exposed from the opening 211A. Accordingly, adouble-sided printed circuit board 17A is obtained.

The first insulating layer 21A usually is adhesive sheets, e.g. FR4epoxy glass cloth half-cured adhesive sheets. The first insulating layer21A and a third wiring layer 22A may be formed by lamination.

A step of forming a plurality of second conductive vias 25A may beprocessed before the steps of forming the third wiring layer 22A. Thesecond conductive vias 25A may be formed by a mechanical drilling or alaser drilling process and then by an electroplating or a via fillingprocess. The via filling process may be a plating process, or a copperpaste filling process, or a silver paste filling process. The thirdwiring layer 22A may be formed by an image transfer process and anetching process. The third wiring layer 22A is electrically connected tothe first wiring layer 132A through the second conductive vias 25A.

FIG. 15 shows that in step 4, a plurality of conductive paste blocks 15Ais formed on the first surface 121A. Each conductive pastes block 15A isaligned with one corresponding electrical contact pads 143A. Each of theconductive paste blocks 15A covers and is electrically connected to oneend of the first conductive via 11A electrically connected to thecorresponding electrical contact pad 143A. A plurality of electroniccomponents 16A is provided. The electronic components 16A areelectrically connected to the conductive paste blocks 15A. Accordingly,a multilayer substrate 20A is obtained.

In the present embodiment, the electronic components 16A may be passiveelements or active elements, (e.g. chips, resistors, or capacitors)which include two electrodes 162A. When the electronic component 16A isarranged on the conductive paste blocks 15A, the two electrodes 162A arerespectively fixed and connected to the corresponding two conductivepaste blocks 15A. The material of the conductive paste blocks 15A can beconductive solder paste, conductive silver paste, or conductive copperpaste, for example.

In other embodiments, the step of forming the conductive paste blocks15A may be processed before the steps of forming the first insulatinglayer 21A.

FIG. 16 shows that in step 5, a second insulating layer 23A and a fourthwiring layer 24A are formed on the second wiring layer 142A in describedorder. A third insulating layer 27A and a fifth wiring layer 28A areformed on the third wiring layer 22A in described order. Accordingly, aprinted circuit board with embedded component 100A is obtained.

The following steps may be used to form the second insulating layer 23A,the fourth wiring layer 24A, the third insulating layer 27A, and thefifth wiring layer 28A.

First, a fifth copper layer (not shown), the third insulating layer 27A,the multilayer substrate 20A, the second insulating layer 23A, and afourth copper layer (not shown) are stacked, and laminated onto eachother to form a main body.

The second insulating layer 23A and the third insulating layer 27Ausually are adhesive sheets, e.g. FR4 epoxy glass cloth half-curedadhesive sheets. After lamination, the second insulating layer 23Acovers the second wiring layer 142A and exposed portions of the secondsurface 122A, then enters into sides of the electronic components 16Aadjacent to the first surface 121A through the filling through hole102A, and fills into gaps between the electronic components 16A and thefirst surface 121. After the lamination is completed, the secondinsulating layer 23A fully fills the filling through hole 102A and thegaps between the electronic components 16A and the first surface 121A.The third insulating layer 27A covers the third wiring layer 22A,exposed surface of the first insulating layer 21A and the surface of theelectronic components 16A, and fills into gaps between the electroniccomponents 16A and the first insulating layer 21A.

Second, a plurality of third conductive vias 26A are formed in thesecond insulating layer 23A, a plurality of fourth conductive vias 29Aare formed in the third insulating layer 27A, and the fourth copperlayer and the fifth copper layer are respectively converted into thefourth wiring layer 24A and the fifth wiring layer 28A. The fourthwiring layer 24A is electrically connected to the second wiring layer142A through the third conductive vias 26A. The fifth wiring layer 28Ais electrically connected to the third wiring layer 22A through thefourth conductive vias 29A. The steps of forming the third conductivevias 26A and the fourth conductive vias 29A may be processed before thesteps of forming the fourth wiring layer 24A and the fifth wiring layer28A. The third conductive vias 26A and the fourth conductive vias 29Amay be formed by a mechanical drilling or a laser drilling process andthen by an electroplating or a via filling process. The hole fillingprocess may be a plating process, or a copper paste filling process, ora silver paste filling process. The fourth wiring layer 24A and thefifth wiring layer 28A may be formed by an image transfer process and anetching process.

There may be two or more wiring layers formed at the side of the fourthwiring layer 24A, and there may be two or more wiring layers formed atthe side of the fifth wiring layer 28A.

The printed circuit board with embedded component 100A in the presentembodiment is similar to the printed circuit board with embeddedcomponent 100 in the first embodiment. The differences include thefollowing items. The printed circuit board with embedded component 100Afurther includes the third insulating layer 27A, the fifth wiring layer28A. The opening 211A is defined to pass through the first insulatinglayer 21A. The electronic component 16 is embedded in the opening 16A.One end of the first conductive vias 11A are exposed from the opening211A. The electronic components 16A are electrically connected to theend of the first conductive via 11A through the conductive paste blocks15A. The third insulating layer 27A covers the third wiring layer 22A,exposed surface of the first insulating layer 21A and the surface of theelectronic components 16A, and fully fills gaps between the electroniccomponents 16A and the first insulating layer 21A. The fifth wiringlayer 28A is formed on the surface of the third insulating layer 27Afurther away from the third wiring layer 22A.

It is understood that the number of the electronic components 16A may bemore than or less than 3. In such case, the number of the conductivepaste blocks 15A, the number of the electrical contact pads 143A, andthe number of the first conductive vias 11A should be changed to matchwith the number of the electronic components 16A.

In the method for making the printed circuit board with embeddedcomponent 100, 100A, the first conductive vias 11, 11A corresponding tothe electronic components 16, 16A are formed first, and then theconductive paste blocks 15, 15A are formed on the ends of the firstconductive vias 11, 11A to electrically connect the electroniccomponents 16, 16A to the printed circuit board with embedded component100, 100A. Accordingly, avoiding an alignment between the electroniccomponents 16, 16A and the first conductive vias 11, 11A. In addition,because there is no alignment, there is no need to use an expensivearrangement machine to arrange the electronic components on themultilayer substrate 20, 20A. The cost of the printed circuit board withembedded component 100, 100A is lowered.

While certain embodiments have been described and exemplified above,various other embodiments will be apparent from the foregoing disclosureto those skilled in the art. The disclosure is not limited to theparticular embodiments described and exemplified but is capable ofconsiderable variation and modification without departure from the scopeand spirit of the appended claims.

What is claimed is:
 1. A method for manufacturing a printed circuit board with an embedded component, comprising: providing a double-sided printed circuit board, the double-sided printed circuit board comprising a base, a first wiring layer and a second wiring layer, the base including a first surface and a second surface opposite to the first surface, the first wiring layer and the second wiring layer being respectively arranged on the first surface and the second surface, the second wiring layer comprising a plurality of electrical contact pads, and a plurality of conductive vias being formed in the base, each electrical contact pad aligned with one corresponding conductive via, and electrically connected to an end of the corresponding conductive via, the other ends of the conductive vias being co-planar or lower than to the first surface, and a filling through hole passing through the base, and the filling through hole being apart from the conductive vias and between the conductive vias; forming a plurality of conductive paste blocks on the first surface, and directly electrically connecting each conductive paste block to one of the conductive vias; providing an electronic component, and arranging the electronic component on surfaces of the conductive paste blocks facing away from the conductive vias to electrically connect the electronic component to the conductive paste blocks; forming a first insulating layer including a third wiring layer on the first wiring layer and forming a second insulating layer including a fourth wiring layer on the second wiring layer in described order, such that the first insulating layer formed on the first wiring layer covers the electronic component, the second insulating layer formed on the second wiring layer covers the second wiring layer and fully fills into the filling through hole and the gaps between the electronic component and the base, forming an opening pass through the first insulating layer, first conductive vias of the plurality of conductive vias being exposed from the opening; and the plurality of conductive paste blocks formed in the opening each conductive pastes block aligned with one corresponding electrical contact pad, the electronic component being arranged in the opening; forming a third insulating layer, the third insulating layer covering the third wiring layer and the electronic components, and filling gaps between the electronic components and the first insulating layer, thereby obtaining a printed circuit board with embedded component.
 2. The method of claim 1, wherein the plurality of conductive paste blocks are made of a material selected from a group consisting of conductive solder paste, conductive silver paste, and conductive copper paste.
 3. A printed circuit board with embedded component, comprising: a double-sided printed circuit board, the double-sided printed circuit board comprising a first wiring layer, a base, and a second wiring layer, the base including a first surface and a second surface opposite to the first surface, the first wiring layer and the second wiring layer being respectively arranged on the first surface and the second surface of the base, the second wiring layer comprising a plurality of electrical contact pads, and a plurality of conductive vias being formed in the base, each electrical contact pad aligned with one corresponding conductive via, and electrically connected to an end of the corresponding conductive via, the other ends of the conductive vias being co-planar or lower than to the first surface, and a filling through hole passing through the base apart from the conductive vias and being between the conductive vias; an electronic component and a plurality of conductive paste blocks, the conductive paste blocks respectively directly electrically connected to the conductive vias, the electronic component being adhered to and electrically connected to surfaces of the conductive paste blocks facing away from the conductive vias; a first insulating layer including a third wiring layer formed on the first wiring layer, a second insulating layer including a fourth wiring layer formed on the second wiring layer, the first insulating layer formed on the first wiring layer covering the electronic component, the second insulating layer formed on the second wiring layer covering the second wiring layer and fully filling into the filling through hole and gaps between the electronic component and the base, an opening being defined to pass through the first insulating layer and the first insulating layer, the first conductive vias being exposed from the opening, the conductive paste blocks and the electronic component being formed in the opening, and a third insulating layer, the third insulating layer covering the third wiring layer and the electronic components, and filling gaps between the electronic components and the first insulating layer, thereby obtaining a printed circuit board with embedded component.
 4. The printed circuit board with embedded component of claim 3, wherein the plurality of conductive paste blocks are made of a material selected from a group consisting of conductive solder paste, conductive silver paste, and conductive copper paste. 